Heat spreading cloths

ABSTRACT

Heat spreading cloths, associated devices, systems, and methods can include a plurality of attached polymeric fibers that are thermally conductive and electrically insulative. The heat spreading cloth can be configured to couple an electronic component thereto in a heat spreading relationship.

BACKGROUND

Typical wearable technology or “wearables” includes and electronicdevice or component incorporated into an article or accessory that canbe worn on a user's body. A growing number of uses have been found forsuch devices, including monitoring and reporting aspects of a user'sphysiology, monitoring and reporting aspects of a surroundingenvironment, participating in geographic location or tracking services,providing power or support for other electronic devices, security andauthentication, and personal climate or comfort, among others. Among themany challenges that wearable technology can face is management of heatas a byproduct of the electronic device or component's operation. Aswith many other electronic devices, electronic components of a wearabledevice can face significant thermal management challenges which limittheir size, operation, or degree to which they can be integrated intothe wearable technology. As such, improved thermal solutions forelectronic components in wearable devices continue to be sought.

BRIEF DESCRIPTION OF THE DRAWINGS

Features and advantages of the disclosure will be apparent from thedetailed description which follows, taken in conjunction with theaccompanying drawings, which together illustrate, by way of example,features of the disclosure; and, wherein:

FIG. 1a illustrates a woven heat spreading cloth in accordance with anexample embodiment;

FIG. 1b illustrates a woven heat spreading cloth in accordance with anexample embodiment;

FIG. 1c illustrates a group of aligned polymeric fibers in accordancewith an example embodiment;

FIG. 1d illustrates the plurality of aligned polymeric fibers of FIG. 1cafter fusing the fibers together, in accordance with an exampleembodiment;

FIG. 2a illustrates a heat spreading cloth with an identifiedelectronics area in a central location in accordance with an exampleembodiment;

FIG. 2b illustrates a heat spreading cloth with an identifiedelectronics area in a peripheral location in accordance with an exampleembodiment;

FIG. 2c illustrates a heat spreading cloth with an identifiedelectronics area in a central location and having a rectangular shape orpattern in accordance with an example embodiment;

FIG. 2d illustrates a heat spreading cloth with an identifiedelectronics area in a central location and having an oval shape orpattern in accordance with an example embodiment;

FIG. 2e illustrates a heat spreading cloth with a plurality ofidentified electronics areas in accordance with an example embodiment;

FIG. 3a illustrates a top view of an electronic component in accordancewith an example embodiment;

FIG. 3b illustrates a side view of the electronic component of FIG. 3 a.

FIG. 3c illustrates a top view of a wearable electronic device inaccordance with an example embodiment;

FIG. 3d illustrates a side view of the wearable electronic device ofFIG. 3 c;

FIG. 4a illustrates a top view of an electronic component in accordancean example embodiment;.

FIG. 4b illustrates a side view of the electronic component of FIG. 4 a.

FIG. 4c illustrates a top view of a wearable electronic device inaccordance with an example embodiment;

FIG. 4d illustrates a side view of the wearable electronic device ofFIG. 4 c.

FIG. 5a illustrates an electronic component and a component base inaccordance with an example embodiment;

FIG. 5b illustrates a side view of a wearable electronic device inaccordance with an example embodiment;

FIG. 5c illustrates a top view of the wearable electronic device of FIG.5 b.

FIG. 5d illustrates a side view of another wearable electronic device inaccordance with an example embodiment;

FIG. 6a illustrates a side view of a wearable electronic deviceconfigured to have a heat spreading cloth engage top and bottom surfacesof an electronic component in accordance with an example embodiment;

FIG. 6b illustrates the wearable electronic device of FIG. 6a with theheat spreading cloth engaging the electronic component and fusedtogether in accordance with an example embodiment;

FIG. 7 illustrates a garment having a wearable electronic device coupledthereto in accordance with an example embodiment;

FIG. 8 illustrates a garment having a wearable electronic device coupledthereto in accordance with another example embodiment;

FIG. 9 illustrates a computing system in accordance with an exampleembodiment;

FIG. 10a illustrates an example of a weaving pattern;

FIG. 10b illustrates an example of another weaving pattern;

FIG. 10c illustrates an example of yet another weaving pattern; and

FIG. 10d illustrates an example of an additional weaving pattern.

DESCRIPTION OF EMBODIMENTS

Although the following detailed description contains many specifics forthe purpose of illustration, a person of ordinary skill in the art willappreciate that many variations and alterations to the following detailscan be made and are considered to be included herein. Accordingly, thefollowing embodiments are set forth without any loss of generality to,and without imposing limitations upon, any claims set forth. It is alsoto be understood that the terminology used herein is for the purpose ofdescribing particular embodiments only, and is not intended to belimiting. Unless defined otherwise, all technical and scientific termsused herein have the same meaning as commonly understood by one ofordinary skill in the art to which this disclosure belongs.

As used in this written description, the singular forms “a,” “an” and“the” include express support for plural referents unless the contextclearly dictates otherwise. Thus, for example, reference to “a sensor”includes support for a plurality of such sensors.

As used herein, “comprises,” “comprising,” “containing” and “having” andthe like can have the meaning ascribed to them in U.S. Patent law andcan mean “includes,” “including,” and the like, and are generallyinterpreted to be open ended terms. The terms “consisting of” or“consists of” are closed terms, and include only the components,structures, steps, or the like specifically listed in conjunction withsuch terms, as well as that which is in accordance with U.S. Patent law.“Consisting essentially of” or “consists essentially of” have themeaning generally ascribed to them by U.S. Patent law. In particular,such terms are generally closed terms, with the exception of allowinginclusion of additional items, materials, components, steps, orelements, that do not materially affect the basic and novelcharacteristics or function of the item(s) used in connection therewith.For example, trace elements present in a composition, but not affectingthe compositions nature or characteristics would be permissible ifpresent under the “consisting essentially of” language, even though notexpressly recited in a list of items following such terminology. Whenusing an open ended term, like “comprising” or “including,” in thiswritten description it is understood that direct support should beafforded also to “consisting essentially of” language as well as“consisting of” language as if stated explicitly and vice versa.

The terms “first,” “second,” “third,” “fourth,” and the like in thedescription and in the claims, if any, are used for distinguishingbetween similar elements and not necessarily for describing a particularsequential or chronological order. It is to be understood that any termsso used are interchangeable under appropriate circumstances such thatthe embodiments described herein are, for example, capable of operationin sequences other than those illustrated or otherwise described herein.Similarly, if a method is described herein as comprising a series ofsteps, the order of such steps as presented herein is not necessarilythe only order in which such steps may be performed, and certain of thestated steps may possibly be omitted and/or certain other steps notdescribed herein may possibly be added to the method.

The terms “left,” “right,” “front,” “back,” “top,” “bottom,” “over,”“under,” and the like in the description and in the claims, if any, areused for descriptive purposes and not necessarily for describingpermanent relative positions. It is to be understood that the terms soused are interchangeable under appropriate circumstances such that theembodiments described herein are, for example, capable of operation inother orientations than those illustrated or otherwise described herein.The term “coupled,” as used herein, is defined as directly or indirectlyconnected in an electrical or nonelectrical manner. Objects describedherein as being “adjacent to” each other may be in physical contact witheach other, in close proximity to each other, or in the same generalregion or area as each other, as appropriate for the context in whichthe phrase is used. Occurrences of the phrase “in one embodiment,” or“in one aspect,” herein do not necessarily all refer to the sameembodiment or aspect.

As used herein, comparative terms such as “increased,” “decreased,”“better,” “worse,” “higher,” “lower,” “enhanced,” “maximized,”“minimized,” and the like refer to a property of a device, component, oractivity that is measurably different from other devices, components, oractivities in a surrounding or adjacent area, in a single device or inmultiple comparable devices, in a group or class, in multiple groups orclasses, or as compared to the known state of the art, or to acomparable device lacking identical features or components. For example,a data region that has an “increased” risk of corruption can refer to aregion of a memory device, which is more likely to have write errors toit than other regions in the same memory device. A number of factors cancause such increased risk, including location, fabrication process,number of program pulses applied to the region, etc.

The terms “coupled” and “attached” can be used interchangeably herein,and are defined as directly or indirectly connected in an electrical ornonelectrical manner. Objects or components that are attached or coupledcan be merely held in a fixed relationship without necessarily beingphysically joined. For example, woven fibers may be attached to oneanother by intertwining through a weaving process. “Directly coupled” or“directly attached” objects, structures, or elements are in physicalcontact with one to another and in some embodiments may be “merged” or“fused” for example by sintering. Objects described herein as being“adjacent to” each other may be in physical contact with each other, inclose proximity to each other, or in the same general region or area aseach other, as appropriate for the context in which the phrase is used.

As used herein, the term “substantially” refers to the complete ornearly complete extent or degree of an action, characteristic, property,state, structure, item, or result. For example, an object that is“substantially” enclosed would mean that the object is either completelyenclosed or nearly completely enclosed. The exact allowable degree ofdeviation from absolute completeness may in some cases depend on thespecific context. However, generally speaking the nearness of completionwill be so as to have the same overall result as if absolute and totalcompletion were obtained. The use of “substantially” is equallyapplicable when used in a negative connotation to refer to the completeor near complete lack of an action, characteristic, property, state,structure, item, or result. For example, a composition that is“substantially free of” particles would either completely lackparticles, or so nearly completely lack particles that the effect wouldbe the same as if it completely lacked particles. In other words, acomposition that is “substantially free of” an ingredient or element maystill actually contain such item as long as there is no measurableeffect thereof.

As used herein, the term “about” is used to provide flexibility to anumerical range endpoint by providing that a given value may be “alittle above” or “a little below” the endpoint. Unless otherwise stated,use of the term “about” in accordance with a specific number ornumerical range should also be understood to provide support for suchnumerical terms or range without the term “about”. For example, for thesake of convenience and brevity, a numerical range of “about 50angstroms to about 80 angstroms” should also be understood to providesupport for the range of “50 angstroms to 80 angstroms.” Furthermore, itis to be understood that in this specification support for actualnumerical values is provided even when the term “about” is usedtherewith. For example, the recitation of “about” 30 should be construedas not only providing support for values a little above and a littlebelow 30, but also for the actual numerical value of 30 as well.

As used herein, a plurality of items, structural elements, compositionalelements, and/or materials may be presented in a common list forconvenience. However, these lists should be construed as though eachmember of the list is individually identified as a separate and uniquemember. Thus, no individual member of such list should be construed as ade facto equivalent of any other member of the same list solely based ontheir presentation in a common group without indications to thecontrary. In addition, various embodiments and examples can be referredto herein along with alternatives for the various components thereof. Itis understood that such embodiments, examples, and alternatives are notto be construed as de facto equivalents of one another, but are to beconsidered as separate and autonomous representations under the presentdisclosure.

Furthermore, the described features, structures, or characteristics canbe combined in any suitable manner in one or more embodiments. In thefollowing description, numerous specific details are provided, such asexamples of layouts, distances, network examples, etc., to provide athorough understanding of embodiments. One skilled in the relevant artwill recognize, however, that the technology can be practiced withoutone or more of the specific details, or with other methods, components,layouts, etc. In other instances, well-known structures, materials, oroperations may not be shown or described in detail to avoid obscuringaspects of the disclosure.

Concentrations, amounts, and other numerical data may be expressed orpresented herein in a range format. It is to be understood that such arange format is used merely for convenience and brevity and thus shouldbe interpreted flexibly to include not only the numerical valuesexplicitly recited as the limits of the range, but also to include allthe individual numerical values or sub-ranges encompassed within thatrange as if each numerical value and sub-range is explicitly recited. Asan illustration, a numerical range of “about 1 to about 5” should beinterpreted to include not only the explicitly recited values of about 1to about 5, but also include individual values and sub-ranges within theindicated range. Thus, included in this numerical range are individualvalues such as 2, 3, and 4 and sub-ranges such as from 1-3, from 2-4,and from 3-5, etc., as well as 1, 2, 3, 4, and 5, individually.

This same principle applies to ranges reciting only one numerical valueas a minimum or a maximum. Furthermore, such an interpretation shouldapply regardless of the breadth of the range or the characteristicsbeing described.

Reference throughout this specification to “an example” means that aparticular feature, structure, or characteristic described in connectionwith the example is included in at least one embodiment. Thus,appearances of the phrases “in an example” in various places throughoutthis specification are not necessarily all referring to the sameembodiment.

Example Embodiments

An initial overview of invention embodiments is provided below andspecific embodiments are then described in further detail. This initialsummary is intended to aid readers in understanding the technologicalconcepts more quickly, but is not intended to identify key or essentialfeatures thereof, nor is it intended to limit the scope of the claimedsubject matter.

One of the challenges associated with wearable or flexible devices isthat there are few thermal solutions available for such devices. Forexample, in some cases, it can be beneficial for a wearable device to bevery thin, light, and/or include multifunctional parts. However, manyexisting thermal solutions are relatively heavy, rigid, and inflexible(e.g. heat sinks, vapor chambers, graphite spreaders, etc.). Thus, somecurrent solutions include power management, limiting range of motion, ordealing with large thermal solutions.

The present disclosure describes examples of heat spreading cloths andassociated devices, systems, and methods to help provide a thermalsolution for wearable electronics devices that can be thin, light, andflexible. For example, heat spreading cloths can include a plurality ofattached polymeric fibers that are thermally conductive and electricallyinsulative. Additionally, heat spreading cloths can include anelectronics area configured to thermally couple to an electronic devicein a heat spreading relationship. Heat spreading cloths can also beincorporated into wearable electronic devices. For example, wearableelectronic devices can include an electronic component and a heatspreading cloth thermally coupled to the electronic component. The heatspreading cloth can include a plurality of attached thermally conductiveand electrically insulative polymeric fibers. Further still, wearableelectronic devices can be incorporated into various systems. Someexample systems can include a wearable electronic device as describedherein and a remote computing device configured to wirelesslycommunicate with the wearable electronic device.

In the present disclosure, it is noted that when discussing the heatspreading cloths, the wearable electronic devices, the systems, and thevarious methods, each of these discussions can be considered applicableto each of these examples, whether or not they are explicitly discussedin the context of that example. Thus, for example, in discussing detailsabout heat spreading cloths per se, such discussion also refers to thewearable electronic devices, the systems, and the various methodsdescribed herein, and vice versa.

FIG. 1a illustrates an example of a heat spreading cloth 100 a. The heatspreading cloth can include a plurality of attached thermally conductiveand electrically insulative polymeric fibers 110 oriented in a radialweave. In this particular example, an electronics area 120 of the heatspreading cloth 110 a can include an area having a high density orconcentration of polymeric fibers 110 (e.g. higher than in other areasof the cloth, for example by increased thickness, density, weavetightness, etc.). FIG. 1b illustrates another example of a heatspreading cloth 100 b. FIG. 1b can illustrate different embodiments of aheat spreading cloth. For example, in some cases, heat spreading cloth100 b can include a plurality of attached or coupled thermallyconductive and electrically insulative polymeric fibers 110 a and 110 bthat are interwoven together in a plain weave. The densely woven area120 can include an electronics area. However, in some other examples,heat spreading cloth 100 b can include a plurality of attached thermallyconductive and electrically insulative polymeric fibers 110 a andplurality of non-thermally conductive carrier fibers 110 b that areco-woven together. In this example, the electronics area can include anarea 120 of the co-weave or another suitable area of attachment to thepolymeric fibers 110 a. In some examples, individual polymeric fiberends can be stitched or otherwise integrated into a larger carrierfabric or garment for use as a heat spreading component of an electronicdevice.

In further detail, a variety of thermally conductive polymeric fiberscan be used to prepare a heat spreading cloth. Typically, any suitablepolymeric fiber can be used that is both thermally conductive andelectrically insulative. In further detail, the polymeric fibers cantypically have a thermal conductivity of greater than or equal to 5watts per meter kelvin (W/m-K). In other examples, the polymeric fiberscan have a thermal conductivity of greater than or equal to 10 W/m-k. Insome other examples, the polymeric fibers can have a thermalconductivity of greater than or equal to 20 W/m-k. In yet otherexamples, the polymeric fibers can have a thermal conductivity ofgreater than or equal to 30 W/m-k, 40 W/m-K, or 50 W/m-K. In somefurther examples, the polymeric fibers can have a thermal conductivityof greater than or equal to 100 W/m-K.

One way of obtaining a polymeric fiber with high thermal conductivity isto stretch or otherwise chemically or mechanically process the polymericfibers to achieve individual polymer chains with a high degree ofmolecular alignment. As will be appreciated by one skilled in the art,bulk polymer materials are typically randomly entangled without a highdegree of molecular alignment and are generally regarded as thermalinsulators. However, individual polymer chains within the bulk materialcan have high thermal conductivities. Without wishing to be bound bytheory, it is believed that the random arrangement of thermallyconductive individual polymer chains can render the overall bulkmaterial thermally insulating. However, a polymeric fiber with highthermal conductivity can be obtained by mechanically, chemically, orotherwise processing the polymeric fibers (e.g. by repeatedly stretchingthe bulk polymer material) until a high degree of molecular alignment isachieved for individual polymer chains within the fiber. In someexamples, the high degree of molecular alignment can increase phonontransport along the polymeric fibers. One way of measuring the degree ofmolecular alignment is by measuring the thermal conductivity of thefiber. For example, in some cases, an unstretched fiber can be thermallyinsulating (e.g. having a thermal conductivity of about 0.1 W/m-K toabout 0.5 W/m-K). After repeatedly stretching the polymeric fiber, thethermal conductivity of the polymeric fiber can increase to provide anon-isotropic thermally conductive polymeric fiber (e.g with a thermalconductivity in a longitudinal direction of at least 5 W/m-K). Ofcourse, the thermal conductivities of the polymer fibers can varydepending on the particular polymeric material employed and the degreeof polymer alignment.

The polymeric fibers can also be electrically insulating. For example,in some general aspects, the polymer fibers can have a dielectricstrength of from about 100 to about 300 kV/cm (kilovolt per centimeter).In some further examples, the volumetric resistivity (e.g. theresistance to flow of electrical current through the three-dimensionalvolume) of the polymeric fibers can be from about 1×10¹² to about 1×10¹⁶ohms/centimeter. Additionally, in some cases, the surface resistivity(e.g. the resistance to flow of electrical current across the surface)of the polymeric fibers can be from about 1×10¹⁰ ohms/square to about1×10¹⁵ ohms/square. Of course, the electrically insulating properties ofthe polymer fibers can vary depending on the particular polymericmaterial employed.

In some specific examples, the polymeric fibers can include or be madeof a thermoplastic material. Non-limiting examples of thermoplasticmaterials can include acrylics (e.g. poly(methyl methacrylate)),acrylate styrene acrylonitrile, acrylonitrile butadiene styrene,ethylene vinyl acetate, polyamides (e.g. nylon), polylactic acid,polybenzimidazole, polycarbonate, polyether sulfone, polyoxymethylene,polyether ketone, polyetherimide, polyethylene, polyphenylene oxide,polyphenylene sulfide, polypropylene, polystyrene, polyurethane,polyvinyl chloride, polyvinylidene fluoride, polytetrafluoroethylene,styrene acrylonitrile, the like, or a combination thereof. In somespecific examples, the thermoplastic material can include ethylene vinylacetate, polyamide, polybenzimidazole, polycarbonate, polyethylene,polypropylene, polyurethane, polyvinyl chloride, the like, orcombinations thereof

In some examples, the use of a thermoplastic material can facilitateattachment of individual polymeric fibers to one another, to a carrierfiber or fabric, to an electronic component, or a combination thereof.For example, where the polymeric fibers include or are made of athermoplastic material, the fibers can be heated to a sufficienttemperature to fuse the polymeric fibers to one another, to a carrierfiber or fabric, to an electronic component, or a combination thereof.One example is illustrated in FIGS. 1c and 1 d. FIG. 1c illustrates aplurality of aligned polymeric fibers 110 of a heat spreading cloth 100c prior to fusion. FIG. 1d illustrates the plurality of alignedpolymeric fibers 110 of FIG. 1c after heat fusion (e.g. heat fusion,chemical fusion, etc.). It is noted that FIGS. 1c and 1d illustrate asimplified version of this process and are intended to be illustrativerather than limiting. As will be appreciated by one skilled in the art,a fusion process, such as a heat fusion process, can be similarlyperformed with any suitable interweaving pattern, co-weaving pattern,etc., of polymeric fibers or types of polymeric fibers and optionallyone or more carrier fibers or types of carrier fibers.

Whether or not heat fusion is employed, individual polymeric fibers canbe attached in a number of ways. In some examples, the polymeric fiberscan be attached to one another by interweaving individual polymericfibers. In some further examples, the interwoven polymeric fibers can befurther heated to fuse the polymeric fibers together, to a carrier fiberor fabric, to an electronic component, or a combination thereof. In someadditional examples, the polymeric fibers can be attached by co-weavingthe polymeric fibers with a carrier fiber. In some further examples, theco-woven polymeric fibers can be further heated to fuse the polymericfibers together, to a carrier fiber or fabric, to an electroniccomponent, or a combination thereof. In some examples, the polymericfibers can be aed by stitching individual polymeric fibers into acarrier fabric. In some further examples, the stitched polymeric fiberscan be further heated to fuse the polymeric fibers together, to acarrier fiber or fabric, to an electronic component, or a combinationthereof.

As described above in some examples, a carrier fiber or carrier fabriccan be used in the heat spreading cloths. Carrier fibers can be valuablein imparting a particular feel, appearance, quality, integrity, etc. forthe heat spreading cloth. In some examples, the carrier fiber or carrierfabric can include or be made of a natural fiber. Non-limiting examplesof natural fibers can include cotton, linen (flax), ramie, silk, wool,cashmere, hemp, jute, the like, or a combination thereof. In someexamples, the carrier fiber or carrier fabric can include or be made ofa synthetic fiber. Non-limiting examples of synthetic fibers can includerayon, polyesters, acrylics, polyethylene, polyvinyl chloride,polychloroprene, aramids, polyamides, elastane, the like, or acombination thereof.

Thus, in some examples, the heat spreading cloths can be formed entirelyof thermally conductive polymeric fibers. In other examples, the heatspreading cloths can be formed of or otherwise comprise thermallyconductive polymeric fibers and carrier fibers. Where this is the case,the polymeric fibers can typically include or form at least 20 weightpercent (wt %) of the heat spreading cloth. In other examples, thepolymeric fibers can include or form at least 30 wt % of the heatspreading cloth. In still other examples, the polymeric fibers caninclude or form at least 40 wt % of the heat spreading cloth. In yetother examples, the polymeric fibers can include or form at least 50 wt% of the heat spreading cloth. In some additional examples, thepolymeric fibers can include or form at least 60 wt %, 70 wt %, or 80 wt% of the heat spreading cloth. In some examples, the heat spreadingcloth can include or be formed entirely of polymeric fibers.

It is noted that the polymeric fibers can have a variety of linear massdensities. Typically, the polymeric fibers can have a linear massdensity of from about 10 denier to about 6000 denier. In some examples,the polymeric fibers can have a linear mass density of from about 60denier to about 1600 denier. In some additional examples, the polymericfibers can have a linear mass density of from about 30 denier to about500 denier.

As described above, the heat spreading cloth can include an electronicsarea configured to thermally couple to an electronic device in a heatspreading relationship. FIGS. 2a-2e illustrate various examples of heatspreading cloths having an electronics area (e.g. an identified,pre-identified, designated, or pre-designated area to which anelectronics device or component is to be coupled or attached). As willall figures contained herein, it is noted that these examples are notnecessarily drawn to scale and are illustrated only generically for thesake of discussion. For example, it is noted individual thermallyconductive polymeric fibers are not illustrated for heat spreadingcloths 200 a-200 e. Nonetheless, heat spreading cloths 200 a-200 e canbe prepared in a number of ways, such as those described elsewhereherein. As non-limiting examples, heat spreading cloths 200 a-200 e canbe prepared by interweaving or fusing thermally conductive polymericfibers (e.g. as shown in FIGS. 1a-1d ), co-weaving thermally conductivepolymeric fibers with carrier fibers (e.g. alternative embodiments inFIGS. 1a and 1b ), stitching polymeric fibers into a carrier fabric,applying a patch of polymeric fibers to a carrier fabric, or the like.With this in mind, FIG. 2a illustrates an electronics area 220positioned centrally on heat spreading cloth 200 a. While in someexamples it can be advantageous to position the electronics areacentrally on the heat spreading cloth, in other examples it may not be.Thus, in some cases, as illustrated in FIG. 2b , an electronics area 220can be positioned toward a perimeter of a heat spreading cloth 200 b. Insome cases, the size and location of the electronics area can alsodepend on the size and/or number of electronics devices to be attachedto the heat spreading cloth. Thus, as illustrated in FIG. 2c , a heatspreading cloth 200 c can include an electronics area 220 that canextend from one perimeter edge of the heat spreading cloth 200 c to anopposing perimeter edge of the heat spreading cloth. In some examples,this can accommodate larger electronic components and/or a plurality ofelectronic components within a common electronics area 220. FIG. 2dillustrates a heat spreading cloth 200 d having a centrally positioned,but elongated, electronics area 220. This can accommodate a specificallysized or shaped electronic component, for example, and can be sized orshaped in any suitable geometry to accommodate a specific electroniccomponent. FIG. 2e illustrates a heat spreading cloth 200 e having aplurality of electronics areas 220 a, 220 b configured for coupling aplurality of electronics devices thereto.

In further detail, in some examples, the electronics area can be markedfor placement of an electronics device. For example, in some cases, theelectronics area can be marked with a label, symbol, or other marking todesignate a specific area of the heat spreading cloth as the electronicsarea. This can be done by printing, dying, stitching, or otherwisemarking the area accordingly. No specific markings or labeling isrequired so long as it identifies the area of the heat spreading clothas the electronics area.

In some other examples, the electronics area can be an area of the heatspreading cloth that includes an effective heat spreading weave ororientation of the polymeric fibers, with or without additional markingsto designate the area as the electronics area.

An effective heat spreading weave can depend on a number of factors,such as the type of fiber employed, fiber thickness, the amount of fiberemployed, the linear mass density of the fiber, the heating power of theelectronic device, etc. Thus, there can be a number of effective heatspreading weaves. Non-limiting examples of weaves that can be effectiveheat spreading weaves can include a plain weave, a basket weave, a twillweave, a jacquard weave, a satin weave, a dobby weave, a radial weave, aleno weave, double cloth weave, the like, or a combination thereof.

In some examples, the electronics area can include an effective heatspreading orientation of the polymeric fibers. For example, thepolymeric fibers need not be interwoven or co-woven with a carrier fiberto be effective heat spreaders. In some examples, the effective heatspreading orientation can include a stitching pattern of the polymericfibers incorporated into a carrier fabric. In other examples, theeffective heat spreading orientation can include a patch including orformed of the polymeric fibers that is adhered to, fused to, stitchedto, or otherwise coupled to a carrier fabric.

In some examples, the electronics area can be an area of the heatspreading cloth that is substantially free of a carrier fiber. In somespecific examples, the electronics area can include from about 0 wt % toabout 50 wt % of a carrier fiber. In other examples, the electronicsarea can include from about 0 wt % to about 10 wt % of a carrier fiber.In still other examples, the electronics area can include from about 5wt % to about 25 wt % of a carrier fiber. In yet other examples, theelectronics area can include from about 15 wt % to about 40 wt % of acarrier fiber. In some examples, the electronics area can include atleast 20 wt %, 30 wt %, 40 wt %, 50 wt % or 60 wt % of the polymericfibers.

In some examples, the electronics area can be an area of the heatspreading cloth including a polymeric material suitable for attachmentof the electronic device thereto via fusing, melting, sintering, or thelike. For example, in some cases, the electronics area can include asufficient amount of polymeric fibers made of a thermoplastic materialthat an electronic device can be attached to the heat spreading cloth atthe electronics area via fusing, melting, sintering, or the like.

While not required, in some additional examples, the electronics areacan be an area that is thicker than the rest of the heat spreadingcloth. For example, in some cases, the electronics area can be at least10% thicker than other areas of the heat spreading cloth. In otherexamples, the electronics area can be at least 25% thicker than otherareas of the heat spreading cloth. In still other examples, theelectronics area can be at least 50% thicker than other areas of theheat spreading cloth. In yet other examples, the electronics area can beat least twice as thick as other areas of the heat spreading cloth. Insome cases, a thickened electronics area can facilitate enhanced localheat spreading. In some additional examples, a thickened electronicsarea can facilitate thermal attachment of an electronic componentthereto. In yet other examples, a thickened electronics area can provideadditional structural support for the electronic component. In somespecific examples, the electronics area can be a location of interfacefor a power source sensor, accessory, plug, the like, or a combinationthereof.

In some additional examples, the electronics area can be an area of theheat spreading cloth that includes a base for mounting or mechanicallysecuring an electronic device thereto. The base can be configured tosecure the electronic device thereto via clamps, clips, screws, pins,threaded attachment, magnetic attachment, friction fitting, straps,cam-lock attachment, adhesive, the like, a combination thereof, or usingother attachment mechanisms. In some examples, the base can include anintermediary heat transfer substrate thermally coupled to the polymericfibers (e.g. as via fusing, melting, or sintering, a portion of thepolymeric fibers to attach the base thereto, for example). Theintermediary heat transfer substrate can be positioned to interface witha heat-generating component of the electronic device. The intermediaryheat transfer substrate can be made of or include any suitable heattransfer material, such as copper, aluminum, graphite, diamond, thelike, or a combination thereof.

As described above, the electronics area can be located at a variety ofpositions of the heat spreading cloth. For example, in some cases, theelectronics area can be disposed at a perimeter of the heat spreadingcloth. In some examples, the electronics area can be disposed at acentral location of the heat spreading cloth. In some examples, the heatspreading cloth can include a plurality of electronics areas. Where thisis the case, the plurality of electronics areas can be positioned at avariety of locations on the heat spreading cloth. For example, in somecases at least one electronics area can be positioned at a centrallocation of the heat spreading cloth. In some examples, at least one ofthe electronics areas can be positioned at a perimeter of the heatspreading cloth. In some examples, at least one of the electronics areascan be positioned at a central location of the heat spreading cloth andat least one electronics area can be positioned at a perimeter of theheat spreading cloth. In some examples, each of the electronics areascan be positioned at a central location of the heat spreading cloth. Inyet other examples, each of the electronics areas can be positioned ator along a perimeter of the heat spreading cloth.

The heat spreading cloth can also be associated with a garment, forexample, to form a wearable article. For example, in some cases, theheat spreading cloth can be attached or otherwise integrated into agarment, such as via sewing, adhering, fusing, magnetically coupling,clipping, clamping, snapping, strapping, tying, securing via hook andloop fasteners, the like, or a combination thereof. In some examples,the heat spreading cloth can be integrated into a garment to form a partof the garment. In either case, a variety of garments or other articlescan be used for attachment of the heat spreading cloth. Non-limitingexamples can include a shirt, pants, shorts, footwear, a jacket, ascarf, a watch, jewelry (e.g. necklace, bracelet, earrings, etc.), aheadband, eyewear, earwear, a glove, a sock, a hat, an undergarment,athletic equipment (e.g. athletic apparel, helmet, mask, protectivepadding, etc.), strap (e.g. chest strap, arm strap, leg strap, etc.) thelike, or a combination thereof.

The present disclosure is also directed to wearable electronic devices.In some examples, a wearable electronic device can include an electroniccomponent and a heat spreading cloth thermally coupled to the electroniccomponent. The heat spreading cloth can include a plurality of attachedthermally conductive and electrically insulative polymeric fibers, suchas those described elsewhere herein. Generally, the heat spreading clothof the wearable electronic device can include one or more of thefeatures described elsewhere herein regarding heat spreading cloths.

As one non-limiting example, FIGS. 3a and 3b illustrate an example of anelectronic component 330 that can be coupled to a heat spreading clothin a heat spreading relationship. For example, as illustrated in FIGS.3c and 3d , electronic component 330 can be coupled to a plurality ofthermally conductive and electrically insulative polymeric fibers 310 ina heat spreading relationship to form a wearable electronic device 302.Similarly, FIGS. 4a and 4b illustrate another example of an electroniccomponent 430 that can be coupled to a heat spreading cloth in a heatspreading relationship. For example, as illustrated in FIGS. 4c and 4d ,electronic component 430 can be coupled to a plurality of thermallyconductive and electrically insulative polymeric fibers 410 a (andoptionally 410 b) in a heat spreading relationship to form a wearableelectronic device 402. As described above, fibers 410 b can representthermally conductive polymeric fibers interwoven with polymeric fibers410 a, or a non-thermally conductive carrier fiber co-woven withpolymeric fibers 410 a, depending on the particular desired application.

A variety of electronic components or devices can be included as part ofthe wearable electronic device, such as computing devices, memory andstorage devices, media devices, data logging and collection devices,control actuators, security tokens/devices, atmospheric, biologic, orpressure sensors or monitors, and the like. More specific electronicdevices or components can include an activity tracker, a heart ratemonitor, a blood pressure monitor, an oxygen monitor, aperspiration/hydration monitor, a sleep monitor, a temperature monitor,a global positioning system (GPS), a gyroscope, or combinations thereof.

The electronic component or device can also include a number ofaccessories such as a speaker, a microphone, a display, an alarmindicator (e.g. audible alarm, visible alarm, vibrational alarm, thermalalarm, or a combination thereof), a light (e.g. a flashlight), a displayscreen or other visual output or indicator, electronic paper (e-paper),an electro-wetting display, adaptive colors, ink (e.g. electronic ink or“e-ink”) or combinations thereof.

The electronic component or device can include a variety of other partsor components, such as a power module, a data collection module, acommunication module, a controller module, the like, or a combinationthereof. A power module can be configured to power the electroniccomponent. Any power source sufficient to adequately power theelectronic component can be used. Batteries, capacitors, solar panels(e.g. flexible solar panels) and/or other power sources (e.g. ambientradio energy, solar energy, optical remote charging, vibration energy,kinetic energy, thermal energy, etc.) may be selected in view of theelectronic component's intended purpose and duration and nature ofoperation. In one aspect, the power module can include a battery. In oneexample the battery can be a rechargeable battery. Other components canbe included in the power module, for example, wires and electricalconnections required to operably connect the power module to othermodules within the electronic component that require power for theiroperation. In one specific example, the power module may includecomponents that inductively charge the battery when exposed to anadequate external influence, such as a wireless or magnetic influence.In such embodiment, if charging of the battery is necessary or desired,the proper external influence can be brought within a sufficient rangeto operate the inductive components and charge the battery withoutphysically accessing the electronic component.

A communication module can be configured to communicate with a remotedevice, such as a computing device (i.e. computer), mobile device (e.g.smart phone or tablet), or cloud database, in order to transmit and/orreceive information. Typical components for such a module may be used.In one aspect, the communication module may include a wirelesstransmitter/receiver capable of wirelessly communicating with the remotedevice. Nearly any wireless frequency, range, protocol or type can beused, for example short-wavelength radio waves in various bands, such asBluetooth (IEEE 802.15.1), Zigbee (IEEE 802.15.4), other IEEE 802.15protocols, WiMAX or other IEEE 802.16 protocols, local area wirelesstechnologies, such as WiFi, WiFi-direct, or other IEEE 802.11 protocols,cellular, including GMA and CDNA, radio, electromagnetic, acousticcommunication (e.g. via piezoelectric transducer, etc.), the like, or acombination thereof. In one embodiment, the wirelesstransmitter/receiver can be a low power consumption device, for example,Bluetooth® low energy (LE).

A controller module can be configured to control the operation of theelectronic component, including all aspects of sensor activity, datacollection, communications, etc. The controller module can beoperatively coupled to the other device modules as necessary to affectsuch control. The controller module can include one or more processorsand memory and can be equipped with program logic sufficient to controlall aspects and function of the device. In one example, the programlogic of the controller may include instructions to control thecommunications module based on sensor activity. For example, thecontroller module can activate or deactivate the communication moduleand/or other device components upon receiving an indication of anamount, presence, or absence of a sensed component or activity.

It is noted that, in some examples, the electronic component can bedesigned to have a heating power less than or equal to 5 watts (W). Insome examples, the heat spreading cloth can be effective at spreadingheat for an electronic component having a heating power less than orequal to 5 W. However, in other examples, the heat spreading cloth canbe effective at spreading heat for an electronic component having aheating power greater than 5 W. In some examples, the electronic devicecan have a heating power of from about 1 W to about 5 W. In some otherexamples, the electronic device can have a heating power of from about0.5 W to about 3 W.

In some other examples, the electronic device can be removably coupledto the heat spreading cloth. In some specific examples, this can beaccomplished via a base coupled to the heat spreading cloth, such as isdescribed elsewhere herein. This is generally illustrated in FIG. 5a .Specifically, an electronic component 530 can be coupled removably (orin some cases, permanently) coupled to a base 540. The base 540 can beconfigured to attach to the electronic component 530 in any suitableway, such as via clamps, clips, screws, pins, threaded attachment,magnetic attachment, friction fitting, straps, cam-lock attachment,adhesive, the like, or a combination thereof. In some examples, asillustrated in FIGS. 5b and 5c , the base 540 can be configured tocouple to the electronic component 530 on a common side of the pluralityof attached polymeric fibers 510 a (and optionally 510 b, which canalternatively represent carrier fibers) to form a wearable electronicdevice 502. In some cases, this can require the base 540 to include anintermediary heat transfer surface or medium to transfer heat to theheat spreading polymeric fibers 510 a. However, in some other examples,as illustrated in FIG. 5d , the base 540 can be configured to couple tothe electronic component 530 through the plurality of attached polymericfibers 510 a to form the wearable device 502. In this example, thepolymeric fibers 510 a can be positioned in direct contact with theelectronic component 530 in a heat spreading relationship. It is notedthat while FIG. 5d illustrates pins or screws penetrating the pluralityof thermally conductive polymeric fibers 510 a to couple to the base 540to the electronic component 530, this can also be accomplished viamagnetic retention or the like without penetrating the plurality ofpolymeric fibers 510 a.

In some examples, the electronic component can be removably attached tothe heat spreading cloth without a base. In some examples, this can beaccomplished via an adhesive, magnetic retention, a clamp, a clip, astrap, screws, pins, a hook and loop fastener, the like, or acombination thereof.

In some examples, the electronic component can be permanently coupled tothe heat spreading cloth. In some examples, the electronic component canbe permanently thermally coupled to the heat spreading cloth via fusing,melting, sintering, or the like a portion of the polymeric fibers tothermally couple the electronic component thereto. One non-limitingexample of permanent attachment is illustrated in FIGS. 6a -6 b. Thesefigures illustrate a process of laminating an electronic device 630between a first heat spreading cloth 600 a and a second heat spreadingcloth 600 b or a first portion 600 a of a heat spreading cloth and asecond portion 600 b of the heat spreading cloth to form a wearableelectronic device 602. In this example, the electronic component can beenveloped by the heat spreading cloth such that the electronic componentis contacted on all sides by the heat spreading cloth. In some examples,the heat spreading cloth can be fused to the electronic component. Inone example, the heat spreading cloth may be or comprise an outerhousing or case for the electronic device or component. In this as wellas in other embodiments, the heat spreading cloth may be directlycoupled to at least one heat-generating part, area, or component of theelectronics device. Such direct contact can maximize transfer andmovement of heat energy away from the electronics device or component.In some embodiments, the contact interface between the heat spreadingcloth and the electronics device or component (or portion thereof,whether as a housing or case or not) can be substantially free of voids,spaces (e.g. air spaces), or gaps and can be substantially continuous.

The wearable electronic device can also be associated with a garment.For example, in some cases, the wearable electronic device can beattached to a garment, such as via sewing, adhering, fusing,magnetically coupling, clipping, clamping, snapping, strapping, tying,securing via hook and loop fasteners, the like, or a combinationthereof. In some examples, the wearable electronic device can beintegrated into a garment to form a part of the garment. In either case,a variety of garments can be used for attachment of the wearableelectronic device. Non-limiting examples can include a shirt, pants,shorts, footwear, a jacket, a scarf, a watch, jewelry (e.g. necklace,bracelet, earrings, etc.), a headband, eyewear, earwear, a glove, a hat,an undergarment, athletic equipment (e.g. athletic apparel, helmet,mask, protective padding, etc.), the like, or a combination thereof.

As one non-limiting example, FIG. 7 illustrates a wearable electronicdevice 702 coupled to a garment 750. The wearable electronic device 702includes a plurality of thermally conductive and electrically insulativepolymeric fibers 710 stitched into the garment 750. An electroniccomponent 730 has been fused to the plurality of polymeric fibers 710 ina heat spreading relationship. As another non-limiting example, FIG. 8illustrates a wearable electronic device 802 integrated into a garment850. In this particular example, wearable electronic device 802 includesa heat spreading cloth 800 that has been integrated into garment 850 soas to form part of the garment 850. An electronic component 830 has beenfused to the heat spreading cloth in a heat spreading relationship.Alternatively, FIG. 8 can represent an embodiment where heat spreadingcloth 800 has been coupled to garment 850 as a patch on a surface ofgarment 850.

In some examples, the wearable electronic device can be included as partof a system. The system can include a wearable electronic device asdescribed herein and a remote computing device configured to wirelesslycommunicate with the wearable electronic device.

FIG. 9 illustrates a simplified example of a system in accordance withsome embodiments of the present disclosure. System 960 may be used inany of the following exemplary systems: a wireless local area network(WLAN) system, a wireless personal area network (WPAN) system, acellular network, the like, or a combination thereof.

System 960 can include a controller 962, an input/output (I/O) device964 (e.g. a keypad, display, etc.), a memory 966, a wireless interface968, and any other suitable component coupled to each other via a bus970. A battery 972 or other power source can be used in someembodiments. It should be noted that such components are merelyexemplary and other components not specifically recited could be used inplace of or included along with one or more of the above-recitedcomponents. In one example, the system 960 may include a processor 974,a power source or battery 972, and a memory 966 coupled to theprocessor.

Controller 962 may comprise, for example, one or more microprocessors,digital signal processors, microcontrollers, or the like. Memory 966 maybe used to store messages transmitted to or by system 960. Memory 966may also optionally be used to store instructions that are executed bycontroller 962 during the operation of system 960, and may be used tostore user data. Memory 966 may be provided by one or more differenttypes of memory. For example, memory 966 may comprise any type of randomaccess memory, a volatile memory, a non-volatile memory such as a flashmemory, etc.

I/O device 964 may be used by a user to generate a message. System 960may use wireless interface 968 to transmit and receive messages to andfrom remote device 990 or other wireless communication network with aradio frequency (RF) signal, for example. Examples of wireless interface968 may include an antenna, a wireless transceiver, or other signaltransmitting/receiving devices.

In further detail, the wearable electronic device can be configured tocommunicate with a variety of remote devices. Remote devices can includea computing device (e.g. a laptop computer, desktop computer, etc.),mobile device (e.g. smart phone, tablet, other smart mobile device,etc.), server, cloud database, gateway, smart hub the like, or acombination thereof. Further, the remote device can be configured towirelessly communicate with the wearable electronic device via anysuitable wireless communication technology. For example, the remotedevice can be configured to communicate with the wearable electronicdevice via Bluetooth® (IEEE 802.15.1), Zigbee® (IEEE 802.15.4), otherIEEE 802.15 protocols, WiMAX or other IEEE 802.16 protocols, local areawireless technologies, such as WiFi, WiFi-direct, or other IEEE 802.11protocols, cellular, including GMA and CDNA, radio, electromagnetic, thelike, or a combination thereof In one embodiment, the wirelesstransmitter/receiver can be a low power consumption device, for example,Bluetooth® low energy (LE).

In some examples, the remote device can be configured to send outgoinginformation to the wearable electronic device. For example, the remotedevice can be configured to transmit user-entered or user-promptedinformation to the wearable electronic device. As a few non-limitingexamples, a user of the wearable electronic device can send commands forthe wearable electronic device to track certain metrics over period oftime (e.g. a used-defined period of time, an automatically recurringperiod of time, etc.), instructions to control standard settings of thewearable electronic device, instructions regarding data collected bywearable electronic device (e.g. to save data, delete data, transferdata, etc.), instructions to transfer data or information from a remotedevice to the wearable electronic device, the like, or a combinationthereof. In still additional examples, a person (e.g. a parent,guardian, health care provider, personal trainer, coach, etc.) otherthan the user of the wearable electronic device can send instructions tothe wearable electronic device to track certain metrics over period oftime (e.g. a used-defined period of time, an automatically recurringperiod of time, etc.), instructions to control standard settings of thewearable electronic device, instructions regarding data collected bywearable electronic device (e.g. to save data, delete data, transferdata, etc.), instructions to transfer data or information from a remotedevice to the wearable electronic device, the like, or a combinationthereof.

Additionally, in some examples, the remote device can be configured toreceive incoming information from the wearable electronic device. Asnon-limiting examples, incoming information can include data (e.g.health data, activity data, location data, etc.) collected by a sensorof the wearable electronics device, or user-entered, user-prompted, oruser-authorized information (e.g. a start time, a goal, occurrence orabsence of a health event, compliance with a health activity,achievement of a milestone, payment authorization, a distress signal, acustomized communication, etc.), or the like, or a combination thereof.In some further examples, incoming information can be transmitted fromthe remote device to a user of the wearable electronic device. Forexample, in some cases, data collected by the wearable electronic devicecan be sent to a remote device for processing and subsequently sent backto the wearable electronic device or second remote device of the user.In some examples, the outgoing processed data can trigger an alarm, analert, a notification, or the like on the wearable electronic device orsecond remote device of the user. In other examples, the information canbe transferred from the remote device to an individual or entity (e.g. aparent, guardian, health care provider, personal trainer, coach, etc.)other than a user of the electronic device, such as to a second remotedevice or other computing device of the individual or entity, forexample. Thus, the remote device can be configured to communicate withthe wearable electronic device in a number of ways, such as thosedescribed herein and other similar configurations.

The present disclosure also describes a number of methods, such asmethods of manufacturing a heat spreading cloth, methods ofmanufacturing a wearable electronics device, and methods of cooling anelectronics device. In further detail, a method of manufacturing a heatspreading cloth can include attaching a plurality of polymeric fibersthat are thermally conductive and electrically insulative. The methodscan also include forming an electronics area of the heat spreadingcloth. The electronics area can be configured to thermally couple to anelectronic device in a heat spreading relationship.

Various methods of attaching the polymeric fibers are contemplated. Asone specific example, the polymeric fibers can be attached byinterweaving individual polymeric fibers together. This can beaccomplished using any suitable weaving pattern or orientation. In someexamples, the polymeric fibers can be attached by co-weaving individualpolymeric fibers with a carrier fiber, as described elsewhere herein.Where this is the case, individual polymeric fibers may not come intodirect contact with one another. However, in some cases, individualpolymeric fibers can come into direct contact with one another whenco-woven with a carrier fiber. Where attaching includes weaving, anysuitable weaving pattern can be used. Non-limiting examples of weavesthat can be effective heat spreading weaves can include a plain weave, abasket weave, a twill weave, a jacquard weave, a satin weave, a dobbyweave, a radial weave, a leno weave, double cloth weave, the like, or acombination thereof. Some non-limiting examples of weaving patterns areillustrated in FIGS. 10a -10 d.

In some additional examples, individual polymeric fibers can be attachedby stitching the polymeric fibers into a carrier fabric in any suitablestitching pattern or orientation. Where this is the case, individualpolymeric fibers may not come into direct contact with one another.However, in some cases, individual polymeric fibers can come into directcontact with one another when stitched into a carrier fabric. In somefurther examples, individual polymeric fibers can be attached bymelting, fusing, sintering, or the like the polymeric fibers together,or to a carrier fiber or fabric, or a combination thereof. Other similarmethods of attaching the polymeric fibers can also be used. It is alsonoted that any suitable combination of methods of attaching thepolymeric fibers can also be used.

Forming an electronics area of the heat spreading cloth can beaccomplished in a number of ways. For example, in some cases, theelectronics area can be formed by preparing an effective heat spreadingweave or orientation of the polymeric fibers, as described elsewhereherein. For example, the effective heat spreading weave or orientationcan provide adequate heat spreading for an electronic device whencoupled to the electronics area in a heat spreading relationship. Insome examples, the electronics area can be marked, such as with an ink,dye, or the like to identify the electronics area.

Methods of manufacturing a wearable electronic device can includeattaching a plurality of polymeric fibers that are thermally conductiveand electrically insulative to form a heat spreading cloth. Anelectronic component can be thermally coupled to the heat spreadingcloth in a heat spreading relationship.

Heat spreading cloths can be prepared as described elsewhere herein. Anelectronic component can be thermally coupled to the heat spreadingcloth in a number of ways, including those described elsewhere herein.It is noted that it can be desirable for the area of contact or the areaof interface between the electronic component and the heat spreadingcloth to be as large as reasonably possible to minimize thermalresistance. This can be balanced with other design considerations of aparticular electronic device and heat spreading cloth. As described,there are numerous ways of coupling an electronic component to a heatspreading cloth. Generally, it is desirable to employ a method ofcoupling the electronic component to the heat spreading cloth thatminimizes or eliminates air pockets or gaps between the electroniccomponent (or a heat producing surface thereof) and the heat spreadingcloth. In some examples, an intermediary heat spreader can be employedbetween the electronic component and the heat spreading cloth. In someexamples, an intermediary heat spreader is not employed between theelectronic component and the heat spreading cloth. In some specificexamples, the electronic component can be coupled to the heat spreadingcloth via sintering, fusing, melting, the like, or a combination thereofIn some examples, an adhesive, such as a flexible adhesive, can beemployed to attach the electronic component to the heat spreading cloth.In some further examples, the adhesive can be doped to enhance a thermalconductivity of the adhesive. In some additional examples, theelectronic component can be mechanically coupled to the heat spreadingcloth. It is noted that any suitable combination of the methods ofcoupling described herein, or in combination with other suitablecoupling methods, can likewise be employed. It is further noted thatthese methods of coupling can be employed to facilitate either permanentor temporary/removable attachment of the electronic component to theheat spreading cloth.

For example, thermally coupling the electronic component to the heatspreading cloth can include permanently coupling the electronic deviceto the heat spreading cloth. For example, in some cases, the electroniccomponent can be permanently coupled to the heat spreading cloth bymelting, fusing, sintering, or the like a portion of the polymericfibers of the heat spreading cloth to thermally couple the electroniccomponent thereto.

In some examples, thermally coupling the electronic component to theheat spreading cloth can include removably coupling the electroniccomponent to the heat spreading cloth. In some examples, this can beaccomplished via a base or mount configured to mechanically couple theelectronic component thereto. The base can be configured to secure theelectronic component thereto via clamps, clips, screws, pins, threadedattachment, magnetic attachment, friction fitting, straps, cam-lockattachment, adhesive, the like, or a combination thereof. In someexamples, the base can include an intermediary heat transfer substratethermally coupled to the polymeric fibers (e.g. as via fusing, melting,or sintering, a portion of the polymeric fibers to attach the basethereto, for example). The intermediary heat transfer substrate can bepositioned to interface with the electronic component to transfer heatfrom the electronic component to the heat spreading cloth. Theintermediary heat transfer substrate can be made of or include anysuitable heat transfer material, such as copper, aluminum, graphite,diamond, the like, or a combination thereof. In some examples, theelectronic component can be removably coupled to the heat spreadingcloth without a base. For example, in some cases, this can beaccomplished via an adhesive, magnetic retention, a clamp, a clip, astrap, screws, pins, a hook and loop fastener, the like, or acombination thereof.

Methods of cooling an electronic device can include attaching aplurality of thermally conductive and electrically insulating polymericfibers to form a heat spreading cloth. Additionally, an electronicdevice can be thermally coupled to the heat spreading cloth in a heatspreading relationship configured to cool the electronic device when inuse.

Methods of attaching polymeric fibers to form a heat spreading cloth aredescribed elsewhere herein. Methods of thermally coupling an electronicdevice to a heat spreading cloth in a heat spreading relationship arealso described elsewhere herein.

As described above, the heat spreading cloths described herein can beeffective heat spreaders for a variety of devices. In some examples, theheat spreading cloths can be effective heat spreaders for devices havinga heating power of less than or equal to 5 W (e.g. from about 2 W toabout 5 W, or from about 1 W to about 4 W, for example). In otherexamples, the heat spreading cloths can be effective heat spreaders fordevices having a heating power greater than 5 W (e.g. from about 5 W toabout 10 W, or greater).

EXAMPLES

The following examples pertain to specific invention embodiments andpoint out specific features, elements, or steps that can be used orotherwise combined in achieving such embodiments.

In one example there is provided, a heat spreading cloth, comprising:

a plurality of attached polymeric fibers, said polymeric fibers beingthermally conductive and electrically insulative; and

an electronics area configured to thermally couple to an electronicdevice in a heat spreading relationship.

In one example of a heat spreading cloth, the plurality of polymericfibers includes a thermoplastic polymeric fiber.

In one example of a heat spreading cloth, the thermoplastic polymerfiber includes polyamide, polybenzimidazole, polycarbonate,polyethylene, polypropylene, polyvinyl chloride, or a combinationthereof.

In one example of a heat spreading cloth, the plurality of polymericfibers includes aligned polymeric fibers having a high degree ofmolecular alignment to provide the aligned polymeric fibers with athermal conductivity of at least 10 times the thermal conductivity ofthe unaligned polymeric fibers.

In one example of a heat spreading cloth, the polymeric fibers have alinear mass density of from 10 denier to 6000 denier.

In one example of a heat spreading cloth, the polymeric fibers have alinear mass density of from 60 denier to about 1600 denier.

In one example of a heat spreading cloth, the polymeric fibers have alinear mass density of from 30 denier to about 500 denier.

In one example of a heat spreading cloth, the polymeric fibers areattached by interweaving the polymeric fibers.

In one example of a heat spreading cloth, the cloth further comprises aplurality of carrier fibers.

In one example of a heat spreading cloth, the carrier fibers are eithernatural fibers or synthetic fibers.

In one example of a heat spreading cloth, the carrier fibers includecotton, flax, wool, ramie, silk, polyamide, polyester, elastane, rayon,polyethylene, polyvinyl chloride, polychloroprene, or a combinationthereof.

In one example of a heat spreading cloth, the plurality of polymericfibers comprises at least 20 wt % of the heat spreading cloth.

In one example of a heat spreading cloth, the plurality of polymericfibers comprises at least 50 wt % of the heat spreading cloth.

In one example of a heat spreading cloth, the polymeric fibers areattached by fusing a portion of the plurality of polymeric fiberstogether or to a carrier fiber.

In one example of a heat spreading cloth, the polymeric fibers have athermal conductivity of at least 5 watts per meter kelvin (W/m-K).

In one example of a heat spreading cloth, the polymeric fibers have athermal conductivity of at least 10 W/m-K.

In one example of a heat spreading cloth, the polymeric fibers have athermal conductivity of at least 20 W/m-K.

In one example of a heat spreading cloth, the polymeric fibers have adielectric strength of at least 10 kV/cm.

In one example of a heat spreading cloth, the electronics area is markedfor placement of an electronic device.

In one example of a heat spreading cloth, the electronics area issubstantially free of a carrier fiber.

In one example of a heat spreading cloth, the electronics area includescarrier fiber in an amount from about 0 wt % to about 50 wt % of acarrier fiber.

In one example of a heat spreading cloth, the electronics area is anarea having an effective heat spreading weave or orientation of thepolymeric fibers.

In one example of a heat spreading cloth, the effective heat spreadingweave includes a plain weave, a basket weave, a twill weave, a jacquardweave, a satin weave, a dobby weave, a radial weave, a leno weave,double cloth weave, or a combination thereof.

In one example of a heat spreading cloth, an effective heat spreadingorientation includes a stitching pattern of the polymeric fibersincorporated into a carrier fabric.

In one example of a heat spreading cloth, the electronics area is anarea of the heat spreading cloth including a polymeric material suitablefor attachment of the electronic device thereto via sintering.

In one example of a heat spreading cloth, the electronics area furthercomprises a base for mechanically securing an electronic device thereto.

In one example of a heat spreading cloth, the electronics area isdisposed at a perimeter of the heat spreading cloth. to In one exampleof a heat spreading cloth, the electronics area is disposed at a centrallocation of the heat spreading cloth.

In one example of a heat spreading cloth, the heat spreading cloth isattached to a garment.

In one example of a heat spreading cloth, the heat spreading cloth isintegrated into a garment to form a part of the garment.

In one example of a heat spreading cloth, the garment is a shirt, pants,shorts, footwear, a jacket, a scarf, a bracelet, a watch, a necklace, achest strap, a headband, an armband, a wristband, eyewear, earwear, aglove, an undergarment, athletic equipment, or a combination thereof.

In one example there is provided a wearable electronic device,comprising an electronic component; and a heat spreading cloth thermallycoupled to the electronic component, said heat spreading clothcomprising a plurality of thermally conductive and electricallyinsulative attached polymeric fibers.

In one example of a wearable electronic device, the plurality ofpolymeric fibers includes a thermoplastic polymeric fiber.

In one example of a wearable electronic device, the thermoplasticpolymer fiber includes polyamide, polybenzimidazole, polycarbonate,polyethylene, polypropylene, polyvinyl chloride, or a combinationthereof.

In one example of a wearable electronic device, the plurality ofpolymeric fibers includes aligned polymeric fibers having a high degreeof molecular alignment to provide the aligned polymeric fibers with athermal conductivity of at least 10 times the thermal conductivity ofthe unaligned polymeric fibers.

In one example of a wearable electronic device, the polymeric fibershave a linear mass density of from 10 denier to 6000 denier.

In one example of a wearable electronic device, the polymeric fibers areattached by interweaving the polymeric fibers.

In one example of a wearable electronic device, the device furthercomprises a plurality of carrier fibers carrier fibers.

In one example of a wearable electronic device, the carrier fibersinclude a natural fiber.

In one example of a wearable electronic device, the carrier fibersinclude a synthetic fiber.

In one example of a wearable electronic device, the carrier fibersinclude cotton, flax, wool, ramie, silk, polyamide, polyester, elastane,rayon, polyethylene, polyvinyl chloride, polychloroprene, or acombination thereof.

In one example of a wearable electronic device, the plurality ofpolymeric fibers comprises at least 20 wt % of the heat spreading cloth.

In one example of a wearable electronic device, the polymeric fibers areattached by fusing a portion of the plurality of polymeric fiberstogether or to a carrier fiber.

In one example of a wearable electronic device, the polymeric fibershave a thermal conductivity of at least 5 W/m-K.

In one example of a wearable electronic device, the heat spreading clothis attached to a garment.

In one example of a wearable electronic device, the heat spreading clothis integrated into a garment to form a part of the garment.

In one example of a wearable electronic device, the garment is a shirt,pants, shorts, footwear, a jacket, a scarf, a bracelet, a watch, anecklace, a headband, eyewear, earwear, a glove, an undergarment,athletic equipment, or a combination thereof.

In one example of a wearable electronic device, the electronic componentincludes an activity tracker, a heart rate monitor, a blood pressuremonitor, an oxygen monitor, a glucose monitor, a hydration monitor, asleep monitor, a temperature monitor, or a combination thereof.

In one example of a wearable electronic device, the electronic componentincludes a speaker, a microphone, a display, an alarm indicator, alight, or a combination thereof.

In one example of a wearable electronic device, the electronic componenthas a heating power of less than or equal to 5 watts (W).

In one example of a wearable electronic device, the electronic componenthas a heating power of from about 1 W to about 5 W.

In one example of a wearable electronic device, the electronic componentis permanently coupled to the heat spreading cloth.

In one example of a wearable electronic device, the electronic componentis thermally coupled to the heat spreading cloth via sintering.

In one example of a wearable electronic device, the electronic componentis removably coupled to the heat spreading cloth.

In one example of a wearable electronic device, the electronic componentis removably coupled to the heat spreading cloth via a base coupled tothe heat spreading cloth.

In one example of a wearable electronic device, the base is configuredto mechanically secure the electronic component thereto via clamping,clipping, riveting, magnetic retention, snapping, strapping, screwing,or a combination thereof.

In one example of a wearable electronic device, the heat spreading clothfurther comprises an electronics area configured to thermally couple tothe electronic component in a heat spreading relationship.

In one example of a wearable electronic device, the electronics area issubstantially free of a carrier fiber.

In one example of a wearable electronic device, the electronics areaincludes carrier fiber in an amount from about 0 wt % to about 50 wt %of carrier fiber.

In one example of a wearable electronic device, the electronics area isan area having an effective heat spreading weave or orientation of thepolymeric fibers.

In one example of a wearable electronic device, the effective heatspreading weave includes a plain weave, a basket weave, a twill weave, ajacquard weave, a satin weave, a dobby weave, a radial weave, a lenoweave, double cloth weave, or a combination thereof.

In one example of a wearable electronic device, the effective heatspreading orientation includes a stitching pattern of the polymericfiber incorporated into a carrier fabric.

In one example there is provided a wearable system comprising: awearable electronic device as recited in any of claims 28-53; and aremote computing device configured to wirelessly communicate with thewearable electronic device.

In one example of a wearable system, the remote device is a phone,tablet, laptop computer, desktop computer, smart hub, gateway, server,or a combination thereof.

In one example of a wearable system, the remote device is configured towirelessly communicate with the wearable electronic device viaBluetooth®, Low Energy Bluetooth®, Z-wave, human body data transmission,Wi-Fi, Wi-MAX, Zigbee®, radio wave communication, microwavecommunication, infrared communication, or combinations thereof.

In one example of a wearable system, the remote device is configured tosend outgoing information to the wearable electronic device.

In one example of a wearable system, the outgoing information includesuser-entered information.

In one example of a wearable system, the remote device is configured toreceive incoming information from the wearable electronic device.

In one example of a wearable system, the incoming information includesdata collected by a sensor of the wearable electronic device.

In one example of a wearable system, the incoming information includesuser-entered information.

In one example of a wearable system, the incoming information is furthertransmitted to a user.

In one example of a wearable system, the remove device is configured tocommunicate with a second remote device.

In one example there is provided a method of manufacturing a heatspreading cloth, comprising: attaching a plurality of polymeric fibers,said polymeric fibers being thermally conductive and electricallyinsulative; and forming an electronics area of the heat spreading cloth,said electronics area being configured to thermally couple to anelectronic device in a heat spreading relationship.

In one example of a method of manufacturing a heat spreading cloth,attaching includes interweaving the polymeric fibers.

In one example of a method of manufacturing a heat spreading cloth,attaching includes attaching the polymeric fibers to a plurality ofcarrier fibers.

In one example of a method of manufacturing a heat spreading cloth, thecarrier fibers include cotton, flax, wool, ramie, silk, polyamide,polyester, elastane, rayon, polyethylene, polyvinyl chloride,polychloroprene, or a combination thereof.

In one example of a method of manufacturing a heat spreading cloth, theplurality of polymeric fibers comprises at least 20 wt % of the heatspreading cloth.

In one example of a method of manufacturing a heat spreading cloth, theplurality of polymeric fibers comprises at least 50 wt % of the heatspreading cloth.

In one example of a method of manufacturing a heat spreading cloth,attaching includes fusing a portion of the plurality of polymeric fiberstogether or to a carrier fiber.

In one example of a method of manufacturing a heat spreading cloth,forming includes preparing an effective heat spreading weave ororientation of the polymeric fibers.

In one example of a method of manufacturing a heat spreading cloth, theeffective heat spreading weave includes a plain weave, a basket weave, atwill weave, a jacquard weave, a satin weave, a dobby weave, a radialweave, a leno weave, double cloth weave, or a combination thereof.

In one example of a method of manufacturing a heat spreading cloth, theeffective heat spreading orientation includes a stitching pattern of thepolymeric fibers incorporated into a carrier fabric.

In one example of a method of manufacturing a heat spreading cloth,forming includes marking the electronics area for placement of theelectronic device.

In one example there is provided a method of manufacturing a wearableelectronic device, comprising: attaching a plurality of polymeric fibersto form a heat spreading cloth, said polymeric fibers being thermallyconductive and electrically insulative; and thermally coupling anelectronic component to the heat spreading cloth in a heat spreadingrelationship.

In one example of a method of manufacturing a wearable electronicdevice, attaching includes interweaving the polymeric fibers.

In one example of a method of manufacturing a wearable electronicdevice, attaching includes attaching the polymeric fibers to a pluralityof carrier fibers.

In one example of a method of manufacturing a wearable electronicdevice, the carrier fibers include cotton, flax, wool, ramie, silk,polyamide, polyester, elastane, rayon, polyethylene, polyvinyl chloride,polychloroprene, or a combination thereof.

In one example of a method of manufacturing a wearable electronicdevice, the plurality of polymeric fibers comprises at least 50 wt % ofthe heat spreading cloth.

In one example of a method of manufacturing a wearable electronicdevice, attaching includes fusing a portion of the plurality ofpolymeric fibers together or to a carrier fiber.

In one example of a method of manufacturing a wearable electronicdevice, thermally coupling includes permanently coupling the electroniccomponent to the heat spreading cloth.

In one example of a method of manufacturing a wearable electronicdevice, thermally coupling includes sintering the heat spreading clothto the electronic component.

In one example of a method of manufacturing a wearable electronicdevice, thermally coupling includes removably coupling the electroniccomponent to the heat spreading cloth.

In one example of a method of manufacturing a wearable electronicdevice, removably coupling includes coupling the electronic component tothe heat spreading cloth via a base coupled to the heat spreading cloth.

In one example of a method of manufacturing a wearable electronicdevice, the base is configured to mechanically secure the electroniccomponent thereto via clamping, clipping, magnetic retention, snapping,strapping, screwing, or a combination thereof.

In one example there is provided a method of cooling an electronicdevice, comprising: attaching a plurality of thermally conductive andelectrically insulative polymeric fibers to form a heat spreading cloth;and thermally coupling an electronic device to the heat spreading clothin a heat spreading relationship configured to cool the electronicdevice when in use.

In one example of a method of cooling an electronic device, individualpolymeric fibers have a thermal conductivity of at least 5 W/m-K.

In one example of a method of cooling an electronic device, attachingincludes interweaving the polymeric fibers.

In one example of a method of cooling an electronic device, attachingincludes attaching the polymeric fibers to a plurality of carrierfibers.

In one example of a method of cooling an electronic device, the carrierfibers include cotton, flax, wool, ramie, silk, polyamide, polyester,elastane, rayon, polyethylene, polyvinyl chloride, polychloroprene, or acombination thereof.

In one example of a method of cooling an electronic device, theplurality of polymeric fibers comprises at least 20 wt % of the heatspreading cloth.

In one example of a method of cooling an electronic device, theelectronic device has a heating power of less than or equal to 5 W.

In one example of a method of cooling an electronic device, attachingincludes fusing a portion of the plurality of polymeric fibers togetheror to a carrier fiber.

In one example of a method of cooling an electronic device, thermallycoupling includes permanently coupling the electronic device to the heatspreading cloth.

In one example of a method of cooling an electronic device, thermallycoupling includes sintering the heat spreading cloth to the electronicdevice.

In one example of a method of cooling an electronic device, thermallycoupling includes removably coupling the electronic device to the heatspreading cloth.

In one example of a method of cooling an electronic device, removablycoupling includes coupling the electronic device to the heat spreadingcloth via a base coupled to the heat spreading cloth.

In one example of a method of cooling an electronic device, the base isconfigured to mechanically secure the electronic device thereto viaclamping, clipping, magnetic retention, snapping, strapping, screwing,or a combination thereof.

While the forgoing examples are illustrative of the specific embodimentsin one or more particular applications, it will be apparent to those ofordinary skill in the art that numerous modifications in form, usage anddetails of implementation can be made without departing from theprinciples and concepts articulated herein. Accordingly, no limitationis intended except as by the claims set forth below.

What is claimed is:
 1. A heat spreading cloth, comprising: a pluralityof attached polymeric fibers, said polymeric fibers being thermallyconductive and electrically insulative; and an electronics areaconfigured to thermally couple to an electronic device in a heatspreading relationship.
 2. The heat spreading cloth of claim 1, whereinthe plurality of polymeric fibers includes a thermoplastic polymericfiber.
 3. The heat spreading cloth of claim 2, wherein the thermoplasticpolymer fiber includes polyamide, polybenzimidazole, polycarbonate,polyethylene, polypropylene, polyvinyl chloride, or a combinationthereof.
 4. The heat spreading cloth of claim 1, wherein the pluralityof polymeric fibers includes aligned polymeric fibers having a highdegree of molecular alignment to provide the aligned polymeric fiberswith a thermal conductivity of at least 10 times the thermalconductivity of the unaligned polymeric fibers.
 5. The heat spreadingcloth of claim 1, wherein the polymeric fibers have a linear massdensity of from 10 denier to 6000 denier.
 6. The heat spreading cloth ofclaim 1, wherein the polymeric fibers are attached by interweaving thepolymeric fibers.
 7. The heat spreading cloth of claim 1, furthercomprising a plurality of carrier fibers.
 8. The heat spreading cloth ofclaim 7, wherein the carrier fibers are either natural fibers orsynthetic fibers.
 9. The heat spreading cloth of claim 7, wherein theplurality of polymeric fibers comprises at least 20 wt % of the heatspreading cloth.
 10. The heat spreading cloth of claim 1, wherein thepolymeric fibers are attached by fusing a portion of the plurality ofpolymeric fibers together or to a carrier fiber.
 11. The heat spreadingcloth of claim 1, wherein the polymeric fibers have a thermalconductivity of at least 5 watts per meter kelvin (W/m-K).
 12. The heatspreading cloth of claim 1, wherein the polymeric fibers have adielectric strength of at least 10 kV/cm.
 13. The heat spreading clothof claim 1, wherein the electronics area is marked for placement of anelectronic device.
 14. The heat spreading cloth of claim 1, wherein theelectronics area is substantially free of a carrier fiber.
 15. The heatspreading cloth of claim 1, wherein the electronics area includescarrier fiber in an amount from about 0 wt % to about 50 wt % of acarrier fiber.
 16. The heat spreading cloth of claim 1, wherein theelectronics area is an area having an effective heat spreading weave ororientation of the polymeric fibers.
 17. The heat spreading cloth ofclaim 1, wherein the electronics area is an area of the heat spreadingcloth including a polymeric material suitable for attachment of theelectronic device thereto via sintering.
 18. The heat spreading cloth ofclaim 1, wherein the electronics area is disposed at a perimeter of theheat spreading cloth.
 19. The heat spreading cloth of claim 1, whereinthe electronics area is disposed at a central location of the heatspreading cloth.
 20. A method of manufacturing a heat spreading cloth,comprising: attaching a plurality of polymeric fibers, said polymericfibers being thermally conductive and electrically insulative; andforming an electronics area of the heat spreading cloth, saidelectronics area being configured to thermally couple to an electronicdevice in a heat spreading relationship.
 21. The method of claim 20,wherein attaching includes interweaving the polymeric fibers.
 22. Themethod of claim 20, wherein attaching includes attaching the polymericfibers to a plurality of carrier fibers.
 23. The method of claim 20,wherein the plurality of polymeric fibers comprises at least 20 wt % ofthe heat spreading cloth.
 24. The method of claim 20, wherein attachingincludes fusing a portion of the plurality of polymeric fibers togetheror to a carrier fiber.
 25. The method of claim 20, wherein formingincludes preparing an effective heat spreading weave or orientation ofthe polymeric fibers.
 26. The method of claim 20, wherein formingincludes marking the electronics area for placement of the electronicdevice.